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Journal description
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Details for article 68 of 76 found articles
| Title: |
Significant inhibition of interfacial Cu6Sn5 IMC and improvement of solder joint strength and reliability by applying (111) nanotwinned Cu substrate and vacuum soldering |
| Author: |
Lu, Xiao Zhang, Liang Liu, Zhi-Quan Gao, Li-Yin Chen, Chen Wu, Chuan-Jiang Huang, Xi Deng, Kai |
| Appeared in: |
Materials characterization |
| Paging: | Volume 208 () nr. C pages p. |
| Year: |
2024 |
| Contents: | |
| Publisher: |
Elsevier Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 68 of 76 found articles
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