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Journal description
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Details for article 60 of 76 found articles
| Title: |
Preparation, characterization and mechanical properties analysis of SAC305-SnBi-Co hybrid solder joints for package-on-package technology |
| Author: |
Zhang, Shuai Jing, Xinyi Chen, Jieshi Paik, Kyung-Wook He, Peng Zhang, Shuye |
| Appeared in: |
Materials characterization |
| Paging: | Volume 208 () nr. C pages p. |
| Year: |
2024 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 60 of 76 found articles
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