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Details for article 100 of 122 found articles
| Title: |
Reliability improvement of SnAgCu interconnections under extreme temperature condition by TiO2 nanoparticles doping: Experiments and first principles calculations |
| Author: |
Chen, Shuai Tian, Ruyu Wen, Jiayue Tian, Yanhong |
| Appeared in: |
Materials characterization |
| Paging: | Volume 207 () nr. C pages p. |
| Year: |
2024 |
| Contents: | |
| Publisher: |
Elsevier Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 100 of 122 found articles
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