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Journal description
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Details for article 39 of 75 found articles
| Title: |
Interfacial bonding mechanisms in ultrasonic-assisted soldered Si/Cu joint using Sn-3.5Ag-4Al solder |
| Author: |
Li, Wenzhao Ding, Zhijie Xue, Haitao Guo, Weibing Chen, Cuixin Jia, Yang Wan, Zheng |
| Appeared in: |
Materials characterization |
| Paging: | Volume 199 () nr. C pages p. |
| Year: |
2023 |
| Contents: | |
| Publisher: |
Elsevier Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 39 of 75 found articles
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