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Details for article 20 of 39 found articles
| Title: |
Macroscale and microscale structural mechanisms capable of delaying the fracture of low-temperature and rapid pressureless Ag sintered electronics packaging |
| Author: |
Kim, Dongjin Kim, Min-Su |
| Appeared in: |
Materials characterization |
| Paging: | Volume 198 () nr. C pages p. |
| Year: |
2023 |
| Contents: | |
| Publisher: |
The Authors |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 20 of 39 found articles
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