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                                       Details for article 2 of 56 found articles
 
 
  Analysis of (Al,Cr,Nb,Ta,Ti)-nitride and -oxynitride diffusion barriers in Cu-Si interconnects by 3D-Secondary Ion Mass Spectrometry
 
 
Title: Analysis of (Al,Cr,Nb,Ta,Ti)-nitride and -oxynitride diffusion barriers in Cu-Si interconnects by 3D-Secondary Ion Mass Spectrometry
Author: Kretschmer, Andreas
Bohrn, Fabian
Hutter, Herbert
Pitthan, Eduardo
Tran, Tuan Thien
Primetzhofer, Daniel
Mayrhofer, Paul Heinz
Appeared in: Materials characterization
Paging: Volume 197 () nr. C pages p.
Year: 2023
Contents:
Publisher: The Authors
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 2 of 56 found articles
 
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