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Analysis of (Al,Cr,Nb,Ta,Ti)-nitride and -oxynitride diffusion barriers in Cu-Si interconnects by 3D-Secondary Ion Mass Spectrometry |
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Title: |
Analysis of (Al,Cr,Nb,Ta,Ti)-nitride and -oxynitride diffusion barriers in Cu-Si interconnects by 3D-Secondary Ion Mass Spectrometry |
Author: |
Kretschmer, Andreas Bohrn, Fabian Hutter, Herbert Pitthan, Eduardo Tran, Tuan Thien Primetzhofer, Daniel Mayrhofer, Paul Heinz |
Appeared in: |
Materials characterization |
Paging: |
Volume 197 () nr. C pages p. |
Year: |
2023 |
Contents: |
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Publisher: |
The Authors |
Source file: |
Elektronische Wetenschappelijke Tijdschriften |
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