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Journal description
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Details for article 114 of 146 found articles
| Title: |
Non-destructive micro analysis of electromigration failures in solder microbumps using 3D X-ray computed tomography |
| Author: |
Tran, Dinh-Phuc Lin, Tzu-Wen Shie, Kai-Cheng Chen, Chih |
| Appeared in: |
Materials characterization |
| Paging: | Volume 194 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Elsevier Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 114 of 146 found articles
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