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Journal description
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Details for article 101 of 146 found articles
| Title: |
Microstructure and mechanical properties of electroplated Ni-Sn TLP bonded joints with different bonding and aging times |
| Author: |
Yan, Guangxu Gill, Vincent Gan, Chee Lip Chen, Zhong |
| Appeared in: |
Materials characterization |
| Paging: | Volume 194 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Elsevier Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 101 of 146 found articles
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