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Journal description
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Details for article 29 of 63 found articles
| Title: |
Effects of size and cooling rate on solidification behavior of freestanding Sn-3.0Ag-0.5Cu solder balls |
| Author: |
Ren, Xiaolei Wang, Yunpeng Zou, Longjiang Liu, Xiaoying Zhao, Ning |
| Appeared in: |
Materials characterization |
| Paging: | Volume 182 () nr. C pages p. |
| Year: |
2021 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 29 of 63 found articles
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