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Microstructure evolution and interdiffusion behaviors of (Ni,Pt)Al coating with and without Re-diffusion barrier on IC21 substrate at 1100°C |
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Titel: |
Microstructure evolution and interdiffusion behaviors of (Ni,Pt)Al coating with and without Re-diffusion barrier on IC21 substrate at 1100°C |
Auteur: |
Liu, Yingkun Yin, Bin Deng, Chunming Li, Qin Zhang, Lijun Deng, Peng Yang, Kun Wu, Chaoqun Liu, Min |
Verschenen in: |
Materials characterization |
Paginering: |
Jaargang 181 () nr. C pagina's p. |
Jaar: |
2021 |
Inhoud: |
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Uitgever: |
Elsevier Inc. |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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