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Microstructure evolution and interdiffusion behaviors of (Ni,Pt)Al coating with and without Re-diffusion barrier on IC21 substrate at 1100°C |
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Title: |
Microstructure evolution and interdiffusion behaviors of (Ni,Pt)Al coating with and without Re-diffusion barrier on IC21 substrate at 1100°C |
Author: |
Liu, Yingkun Yin, Bin Deng, Chunming Li, Qin Zhang, Lijun Deng, Peng Yang, Kun Wu, Chaoqun Liu, Min |
Appeared in: |
Materials characterization |
Paging: |
Volume 181 () nr. C pages p. |
Year: |
2021 |
Contents: |
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Publisher: |
Elsevier Inc. |
Source file: |
Elektronische Wetenschappelijke Tijdschriften |
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