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Details for article 4 of 33 found articles
| Title: |
Continuous growth and coarsening mechanism of the orientation-preferred Cu6Sn5 at Sn-3.0Ag/(001)Cu interface |
| Author: |
Ma, H.R. Dong, C. Priyanka, P. Wang, Y.P. Li, X.G. Ma, H.T. Chen, J. |
| Appeared in: |
Materials characterization |
| Paging: | Volume 166 () nr. C pages p. |
| Year: |
2020 |
| Contents: | |
| Publisher: |
Elsevier Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 4 of 33 found articles
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