|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 24 of 29 found articles
| Title: |
Microstructure of Cu-diamond composites with near-perfect interfaces prepared via electroplating and its thermal properties |
| Author: |
Wu, Yongpeng Sun, Yunna Luo, Jiangbo Cheng, Ping Wang, Yan Wang, Hong Ding, Guifu |
| Appeared in: |
Materials characterization |
| Paging: | Volume 150 (2019) nr. C pages 199-206 |
| Year: |
2019 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 24 of 29 found articles
| << previous | next >> |