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Details for article 15 of 29 found articles
| Title: |
Effects of interface area density and solid solution on the microhardness of Cu-Nb microcomposite wires |
| Author: |
Deng, Liping Liu, Zhifeng Wang, Bingshu Han, Ke Xiang, Hongliang |
| Appeared in: |
Materials characterization |
| Paging: | Volume 150 (2019) nr. C pages 62-66 |
| Year: |
2019 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 15 of 29 found articles
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