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Journal description
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Details for article 29 of 41 found articles
| Title: |
Microstructure, IMCs layer and reliability of Sn-58Bi solder joint reinforced by Mo nanoparticles during thermal cycling |
| Author: |
Yang, Li Zhu, Lu Zhang, Yaocheng Zhou, Shiyuan Wang, Guoqiang Shen, Sai Shi, Xiaolong |
| Appeared in: |
Materials characterization |
| Paging: | Volume 148 () nr. C pages 280-291 |
| Year: |
2019 |
| Contents: | |
| Publisher: |
Elsevier Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 29 of 41 found articles
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