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Journal description
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Details for article 48 of 70 found articles
| Title: |
Microstructure evolution and mechanical properties of Cu/Sn/Ag TLP-bonded joint during thermal aging |
| Author: |
Shao, Huakai Wu, Aiping Bao, Yudian Zhao, Yue Zou, Guisheng Liu, Lei |
| Appeared in: |
Materials characterization |
| Paging: | Volume 144 (2018) nr. C pages 469-478 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
Elsevier Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 48 of 70 found articles
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