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Microstructure evolution, grain morphology variation and mechanical property change of Cu-Sn intermetallic joints subjected to high-temperature aging |
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Title: |
Microstructure evolution, grain morphology variation and mechanical property change of Cu-Sn intermetallic joints subjected to high-temperature aging |
Author: |
Liu, Jihou Zhao, Hongyun Li, Zhuolin Song, Xiaoguo Zhao, Yixuan Niu, Hongwei Tian, Hao Dong, Hongjie Feng, Jicai |
Appeared in: |
Materials characterization |
Paging: |
Volume 135 (2018) nr. C pages 238-244 |
Year: |
2018 |
Contents: |
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Publisher: |
Elsevier Inc. |
Source file: |
Elektronische Wetenschappelijke Tijdschriften |
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