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Details for article 3 of 60 found articles
| Title: |
A study on interfacial phase evolution during Cu/Sn/Cu soldering with a micro interconnected height |
| Author: |
Yao, Peng Li, Xiaoyan Liang, Xiaobo Yu, Bo Jin, Fengyang Li, Yang |
| Appeared in: |
Materials characterization |
| Paging: | Volume 131 (2017) nr. C pages 49-63 |
| Year: |
2017 |
| Contents: | |
| Publisher: |
Elsevier Inc. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 60 found articles
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