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Details for article 28 of 47 found articles
| Title: |
Microstructure evolution and bonding mechanism of Ti2SnC-Ti6Al4V joint by using Cu pure foil interlayer |
| Author: |
Yu, W. Zhao, H. Huang, Z. Chen, X. Aman, Y. Li, S. Zhai, H. Guo, Z. Xiong, S. |
| Appeared in: |
Materials characterization |
| Paging: | Volume 127 (2017) nr. C pages 53-59 |
| Year: |
2017 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 28 of 47 found articles
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