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Journal description
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Details for article 208 of 229 found articles
| Title: |
The Ag/Cu interface stress |
| Author: |
Berger, S. Spaepen, F. |
| Appeared in: |
Nanostructured materials |
| Paging: | Volume 6 (1995) nr. 1-4 pages 4 p. |
| Year: |
1995 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 208 of 229 found articles
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