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                                       Details for article 18 of 25 found articles
 
 
  Microdiamond/PLA composites with enhanced thermal conductivity through improving filler/matrix interface compatibility
 
 
Title: Microdiamond/PLA composites with enhanced thermal conductivity through improving filler/matrix interface compatibility
Author: Su, Shiuan-Haur
Huang, Yajie
Qu, Shilian
Liu, Wei
Liu, Rongxuan
Li, Liangliang
Appeared in: Diamond and related materials
Paging: Volume 81 () nr. C pages 161-167
Year: 2018
Contents:
Publisher: Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 18 of 25 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands