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  Brazing of diamond to invar with Ag-Cu-Ti filler alloy: Wettability, microstructure and mechanical performance
 
 
Title: Brazing of diamond to invar with Ag-Cu-Ti filler alloy: Wettability, microstructure and mechanical performance
Author: Li, Yulong
Wu, Qi
Lin, Wei
Wu, Haoyue
Tu, Bing
Zhang, Lin
Pan, Pan
Lei, Min
Appeared in: Diamond and related materials
Paging: Volume 145 () nr. C pages p.
Year: 2024
Contents:
Publisher: Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 5 of 83 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands