|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 56 of 167 found articles
| Title: |
Exploring the role of indium on the microstructure evolution and interface bonding behavior of brazing diamond abrasive with modified Cu–Sn–Ti |
| Author: |
Cui, Bing Liu, Zhengwei Du, Quanbin Deng, Hailiang Yang, Li |
| Appeared in: |
Diamond and related materials |
| Paging: | Volume 136 () nr. C pages p. |
| Year: |
2023 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 56 of 167 found articles
| << previous | next >> |