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                                       Details for article 44 of 66 found articles
 
 
  Microstructure evolution and joining strength of diamond brazed on Ti-6Al-4V substrates using Ti-free eutectic Ag-Cu filler alloy
 
 
Title: Microstructure evolution and joining strength of diamond brazed on Ti-6Al-4V substrates using Ti-free eutectic Ag-Cu filler alloy
Author: Liao, Xinjiang
Liu, Zhuo
Liu, Ruixiang
Mu, Dekui
Appeared in: Diamond and related materials
Paging: Volume 127 () nr. C pages p.
Year: 2022
Contents:
Publisher: Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 44 of 66 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands