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Design and implementation of dummy fill for chemical-mechanical polishing in superconducting single flux quantum circuit fabrication process |
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Titel: |
Design and implementation of dummy fill for chemical-mechanical polishing in superconducting single flux quantum circuit fabrication process |
Auteur: |
Chen, Mingfan Ying, Liliang Li, Lijuan Zhang, Xue Wu, Yu Shi, Weifeng Xie, Hui Ma, Linxian Ren, Jie |
Verschenen in: |
Physica. C, Superconductivity and its applications |
Paginering: |
Jaargang 630 () nr. C pagina's p. |
Jaar: |
2025 |
Inhoud: |
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Uitgever: |
Published by Elsevier B.V. |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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