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Journal description
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Details for article 15 of 18 found articles
| Title: |
Research of LTCC/Cu, Ag multilayer substrate in microelectronic packaging |
| Author: |
Wang, Yonggang Zhang, Guangneng Ma, Jusheng |
| Appeared in: |
Materials science and engineering. B, Solid-state materials for advanced technology |
| Paging: | Volume 94 (2002) nr. 1 pages 6 p. |
| Year: |
2002 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 15 of 18 found articles
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