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Evolution of interface voids and columnar grains of the FeCrAl/RAFMs HIP bonding joint |
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Title: |
Evolution of interface voids and columnar grains of the FeCrAl/RAFMs HIP bonding joint |
Author: |
Du, Pei-Song Wang, Wan-Jing Wang, Ji-Chao Xu, Hua-Qi Wang, Qiao-ling Yu, Zi-Yang Zhang, Wen-jing Chen, Hao Liu, Wei Xu, Yu-Ping Zhou, Hai-Shan Luo, Guang-Nan |
Appeared in: |
Materials science and engineering. A, Structural materials: properties, microstructure and processing |
Paging: |
Volume 915 () nr. C pages p. |
Year: |
2024 |
Contents: |
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Publisher: |
Elsevier B.V. |
Source file: |
Elektronische Wetenschappelijke Tijdschriften |
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