|
Driving forces of solid-state Cu-to-Cu direct bonding suppressing the work-hardening loss by refill friction stir spot welding |
|
|
|
Titel: |
Driving forces of solid-state Cu-to-Cu direct bonding suppressing the work-hardening loss by refill friction stir spot welding |
Auteur: |
Lee, Sangmin Baek, Seungyeop Lee, Seung-Joon Chen, Chuantong Nishijima, Masahiko Suganuma, Katsuaki Utsunomiya, Hiroshi Ma, Ninshu Yu, Ha-Young Kim, Dongjin |
Verschenen in: |
Materials science and engineering. A, Structural materials: properties, microstructure and processing |
Paginering: |
Jaargang 915 () nr. C pagina's p. |
Jaar: |
2024 |
Inhoud: |
|
Uitgever: |
Elsevier B.V. |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
|
|
|
|