Joining SiCf/SiC composites to Al0.3CoCrFeNi high-entropy alloys with a Cu–Ti filler alloy: Interfacial reactions, high-entropy effects, and mechanical properties
Titel:
Joining SiCf/SiC composites to Al0.3CoCrFeNi high-entropy alloys with a Cu–Ti filler alloy: Interfacial reactions, high-entropy effects, and mechanical properties
Auteur:
Yang, Jia Liu, Weihang Fu, Mengchun Wen, Jiawen Li, Ke Lin, Panpan Wang, Ce He, Peng Lin, Tiesong Mei, Han Liu, Yue
Verschenen in:
Materials science and engineering. A, Structural materials: properties, microstructure and processing