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  The influence of solution temperature on microstructure evolution and mechanical properties of ATI 718Plus repaired by wire and arc additive manufacturing
 
 
Title: The influence of solution temperature on microstructure evolution and mechanical properties of ATI 718Plus repaired by wire and arc additive manufacturing
Author: Chen, Yuanhang
Yang, Chunli
Fan, Chenglei
Wang, Minqing
Appeared in: Materials science and engineering. A, Structural materials: properties, microstructure and processing
Paging: Volume 852 () nr. C pages p.
Year: 2022
Contents:
Publisher: Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

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 Koninklijke Bibliotheek - National Library of the Netherlands