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Low-temperature Cu-to-Cu bonding using silver nanoparticles stabilised by saturated dodecanoic acid |
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Titel: |
Low-temperature Cu-to-Cu bonding using silver nanoparticles stabilised by saturated dodecanoic acid |
Auteur: |
Li, Wen-Hua Lin, Pei-Syuan Chen, Chen-Ni Dong, Teng-Yuan Tsai, Chi-Hang Kung, Wan-Ting Song, Jenn-Ming Chiu, Ying-Ta Yang, Ping-Feng |
Verschenen in: |
Materials science and engineering. A, Structural materials: properties, microstructure and processing |
Paginering: |
Jaargang 613 (2014) nr. C pagina's 7 p. |
Jaar: |
2014 |
Inhoud: |
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Uitgever: |
Elsevier B.V. |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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