|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 99 of 131 found articles
| Title: |
Study on melt properties, microstructure, tensile properties of low Ag content Sn–Ag–Zn Lead-free solders |
| Author: |
Luo, Tingbi Chen, Zhuo Hu, Anmin Li, Ming |
| Appeared in: |
Materials science and engineering. A, Structural materials: properties, microstructure and processing |
| Paging: | Volume 556 (2012) nr. C pages 6 p. |
| Year: |
2012 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 99 of 131 found articles
| << previous | next >> |