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Journal description
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Details for article 35 of 47 found articles
| Title: |
Microstructure, mechanical, and thermal properties of the Sn–1Ag–0.5Cu solder alloy bearing Fe for electronics applications |
| Author: |
Shnawah, Dhafer Abdul-Ameer Said, Suhana Binti Mohd Sabri, Mohd Faizul Mohd Badruddin, Irfan Anjum Che, Fa Xing |
| Appeared in: |
Materials science and engineering. A, Structural materials: properties, microstructure and processing |
| Paging: | Volume 551 (2012) nr. C pages 9 p. |
| Year: |
2012 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 35 of 47 found articles
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