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                                       Details for article 41 of 61 found articles
 
 
  Nanomechanical response and creep behavior of electroless deposited copper films under nanoindentation test
 
 
Title: Nanomechanical response and creep behavior of electroless deposited copper films under nanoindentation test
Author: Chang, Shou-Yi
Lee, Yu-Shuien
Chang, Ting-Kui
Appeared in: Materials science and engineering. A, Structural materials: properties, microstructure and processing
Paging: Volume 423 (2006) nr. 1-2 pages 5 p.
Year: 2006
Contents:
Publisher: Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 41 of 61 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands