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                                       Details for article 31 of 49 found articles
 
 
  Mechanical and microstructural properties of SnAgCu solder joints
 
 
Title: Mechanical and microstructural properties of SnAgCu solder joints
Author: Sundelin, Janne J.
Nurmi, Sami T.
Lepistö, Toivo K.
Ristolainen, Eero O.
Appeared in: Materials science and engineering. A, Structural materials: properties, microstructure and processing
Paging: Volume 420 (2006) nr. 1-2 pages 8 p.
Year: 2006
Contents:
Publisher: Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 31 of 49 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands