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Journal description
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Details for article 36 of 45 found articles
| Title: |
Reliability of Sn–Ag–Sb lead-free solder joints |
| Author: |
Lee, Hwa-Teng Lin, Heng-Sheng Lee, Cheng-Shyan Chen, Po-Wei |
| Appeared in: |
Materials science and engineering. A, Structural materials: properties, microstructure and processing |
| Paging: | Volume 407 (2005) nr. 1-2 pages 9 p. |
| Year: |
2005 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 36 of 45 found articles
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