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                                       Details for article 32 of 70 found articles
 
 
  Insulation and passivation of three-dimensional substrates by plasma-CVD thin films using silicon-organic compounds
 
 
Title: Insulation and passivation of three-dimensional substrates by plasma-CVD thin films using silicon-organic compounds
Author: Peters, D.
Müller, J.
Sperling, T.
Appeared in: Materials science and engineering. A, Structural materials: properties, microstructure and processing
Paging: Volume 139 (1991) nr. C pages 5 p.
Year: 1991
Contents:
Publisher: Published by Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 32 of 70 found articles
 
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