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Environment-friendly chemical mechanical polishing for copper with atomic surface confirmed by transmission electron microscopy |
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Title: |
Environment-friendly chemical mechanical polishing for copper with atomic surface confirmed by transmission electron microscopy |
Author: |
Liu, Dongdong Zhang, Zhenyu Feng, Jiajian Yu, Zhibin Meng, Fanning Shi, Chunjing Xu, Guanghong Shi, Shuyan Liu, Wei |
Appeared in: |
Colloids and surfaces. A, Physicochemical and engineering aspects |
Paging: |
Volume 656 () nr. PB pages p. |
Year: |
2023 |
Contents: |
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Publisher: |
Elsevier B.V. |
Source file: |
Elektronische Wetenschappelijke Tijdschriften |
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