Role of thermal stress-driven dislocation and low-angle grain boundary migration in surface plastic deformation and grain orientation evolution of tungsten under thermal shock
Titel:
Role of thermal stress-driven dislocation and low-angle grain boundary migration in surface plastic deformation and grain orientation evolution of tungsten under thermal shock
Auteur:
Ren, Meng-Chong Nie, Yu-Fei Wang, Han-Qing Yuan, Yue Feng, Fan Lian, You-Yun Yin, Hao Cheng, Long Shi, Duo-Qi Lu, Guang-Hong