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                                       Details for article 9 of 14 found articles
 
 
  Fine grinding of silicon wafers: effects of chuck shape on grinding marks
 
 
Title: Fine grinding of silicon wafers: effects of chuck shape on grinding marks
Author: Sun, Wangping
Pei, Z.J.
Fisher, G.R.
Appeared in: International journal of machine tools & manufacture
Paging: Volume 45 (2005) nr. 6 pages 14 p.
Year: 2005
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 9 of 14 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands