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Journal description
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Details for article 25 of 25 found articles
| Title: |
Thermal analysis of COB array soldered on heat sink |
| Author: |
He, Fan Chen, Qinghua Liu, Juanfang Liu, Jiao |
| Appeared in: |
International communications in heat and mass transfer |
| Paging: | Volume 59 (2014) nr. C pages 6 p. |
| Year: |
2014 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 25 of 25 found articles
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