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Journal description
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Details for article 8 of 25 found articles
| Title: |
Effect of stacking chips and inlet positions on void formation in the encapsulation of 3D stacked flip-chip package |
| Author: |
Khor, C.Y. Abdullah, M.Z. Ariff, Z.M. Leong, W.C. |
| Appeared in: |
International communications in heat and mass transfer |
| Paging: | Volume 39 (2012) nr. 5 pages 11 p. |
| Year: |
2012 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 8 of 25 found articles
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