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Journal description
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Details for article 2 of 29 found articles
| Title: |
Analysis of encapsulation process in 3D stacked chips with different microbump array |
| Author: |
Ong, Ernest E.S. Abdullah, M.Z. Khor, C.Y. Loh, W.K. Ooi, C.K. Chan, R. |
| Appeared in: |
International communications in heat and mass transfer |
| Paging: | Volume 39 (2012) nr. 10 pages 8 p. |
| Year: |
2012 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 2 of 29 found articles
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