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Journal description
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Details for article 55 of 116 found articles
| Title: |
Heat transfer analysis of grooved mechanical seal: A numerical study |
| Author: |
Saha, Sandip K. Singh, Harpal |
| Appeared in: |
International communications in heat and mass transfer |
| Paging: | Volume 156 () nr. C pages p. |
| Year: |
2024 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 55 of 116 found articles
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