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                                       Details for article 13 of 24 found articles
 
 
  Kinetic analysis of Cu and Zn dissolution from printed circuit board physical processing dust under oxidative ammonia leaching
 
 
Title: Kinetic analysis of Cu and Zn dissolution from printed circuit board physical processing dust under oxidative ammonia leaching
Author: Oluokun, Oluwayimika Olasunkanmi
Otunniyi, Iyiola Olatunji
Appeared in: Hydrometallurgy
Paging: Volume 193 () nr. C pages p.
Year: 2020
Contents:
Publisher: Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 13 of 24 found articles
 
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