Digital Library
Close Browse articles from a journal
 
<< previous   
     Journal description
       All volumes of the corresponding journal
         All issues of the corresponding volume
           All articles of the corresponding issues
                                       Details for article 97 of 97 found articles
 
 
  Thermal contact analysis of Flip-Chip package considering microscopic contacts of double-layer thermal interface materials
 
 
Title: Thermal contact analysis of Flip-Chip package considering microscopic contacts of double-layer thermal interface materials
Author: Wang, Chen
Lin, Qiyin
Pan, Zongkun
Hong, Jun
Zhou, Yicong
Appeared in: Applied energy
Paging: Volume 356 () nr. C pages p.
Year: 2024
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 97 of 97 found articles
 
<< previous   
 
 Koninklijke Bibliotheek - National Library of the Netherlands