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Microscopic removal mechanism of 4 H-SiC during abrasive scratching in aqueous H2O2 and H2O: Insights from ReaxFF molecular dynamics |
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Titel: |
Microscopic removal mechanism of 4 H-SiC during abrasive scratching in aqueous H2O2 and H2O: Insights from ReaxFF molecular dynamics |
Auteur: |
Ban, Xinxing Zheng, Shaodong Tian, Zhuangzhi Zhu, Jianhui Ba, Wenlan Wang, Ningchang Han, Shaoxing Qiu, Hui Wang, Xing Li, Zhengxin |
Verschenen in: |
Tribology international |
Paginering: |
Jaargang 200 () nr. C pagina's p. |
Jaar: |
2024 |
Inhoud: |
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Uitgever: |
Elsevier Ltd |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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