|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 53 of 92 found articles
| Title: |
Intelligent defect inspection of flip chip based on vibration signals and improved gcForest |
| Author: |
Su, Lei Hu, Xiao Gu, Jiefei Ji, Yong Wang, Gang Ming, Xuefei Li, Ke Pecht, Michael |
| Appeared in: |
Measurement |
| Paging: | Volume 214 () nr. C pages p. |
| Year: |
2023 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 53 of 92 found articles
| << previous | next >> |