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Influence of electropolished copper substrate on morphology of electroplating self-supporting Ni films |
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Titel: |
Influence of electropolished copper substrate on morphology of electroplating self-supporting Ni films |
Auteur: |
Wang, Xiaoyu Han, Yuncheng Zhang, Jiachen Li, Ziwei Li, Taosheng Zhao, Xueyan Liu, Weiping |
Verschenen in: |
Nuclear instruments and methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment |
Paginering: |
Jaargang 927 (2019) nr. C pagina's 343-348 |
Jaar: |
2019 |
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Uitgever: |
Elsevier B.V. |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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