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Cost effective flip chip assembly and interconnection technologies for large area pixel sensor applications |
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Titel: |
Cost effective flip chip assembly and interconnection technologies for large area pixel sensor applications |
Auteur: |
Fritzsch, T. Jordan, R. Oppermann, H. Ehrmann, O. Töpper, M. Baumgartner, T. Lang, K.-D. |
Verschenen in: |
Nuclear instruments and methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment |
Paginering: |
Jaargang 650 (2011) nr. 1 pagina's 5 p. |
Jaar: |
2011 |
Inhoud: |
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Uitgever: |
Elsevier B.V. |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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